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RELIFE 10 IN 1 BGA Reballing Platform for iPhone X/XS/11/11 Pro/12 Pro Max Motherboard Middle-Level Tin Planting With Stencil

Home » Tools » Welding & Soldering Supplies » RELIFE 10 IN 1 BGA Reballing Platform for iPhone X/XS/11/11 Pro/12 Pro Max Motherboard Middle-Level Tin Planting With Stencil
Enlarge RELIFE 10 IN 1 BGA Reballing Platform for iPhone X/XS/11/11 Pro/12 Pro Max Motherboard Middle-Level Tin Planting With Stencil
RELIFE 10 IN 1 BGA Reballing Platform for iPhone X/XS/11/11 Pro/12 Pro Max Motherboard Middle-Level Tin Planting With Stencil enlarge
RELIFE 10 IN 1 BGA Reballing Platform for iPhone X/XS/11/11 Pro/12 Pro Max Motherboard Middle-Level Tin Planting With Stencil enlarge
RELIFE 10 IN 1 BGA Reballing Platform for iPhone X/XS/11/11 Pro/12 Pro Max Motherboard Middle-Level Tin Planting With Stencil enlarge
RELIFE 10 IN 1 BGA Reballing Platform for iPhone X/XS/11/11 Pro/12 Pro Max Motherboard Middle-Level Tin Planting With Stencil enlarge
RELIFE 10 IN 1 BGA Reballing Platform for iPhone X/XS/11/11 Pro/12 Pro Max Motherboard Middle-Level Tin Planting With Stencil enlarge
RELIFE 10 IN 1 BGA Reballing Platform for iPhone X/XS/11/11 Pro/12 Pro Max Motherboard Middle-Level Tin Planting With Stencil enlarge
Price from: 61.14 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

RELIFE 10 IN 1 BGA Reballing Platform for iPhone X/XS/11/11 Pro/12 Pro Max Motherboard Middle-Level Tin Planting With Stencil
Introducing the RELIFE 10 IN 1 BGA Reballing Platform, the ultimate solution for reballing the motherboard of your iPhone X, XS, 11, 11 Pro, or 12 Pro Max. This innovative platform is designed to provide a middle-level tin planting process, ensuring precise and efficient reballing of the motherboard. With the included stencil, you can effortlessly achieve professional-level results.

The RELIFE 10 IN 1 BGA Reballing Platform is specifically engineered to cater to the intricate needs of iPhone X, XS, 11, 11 Pro, and 12 Pro Max motherboards. It offers a middle-level tin planting process, which guarantees superior quality and durability. The platform's design ensures that the tin is evenly distributed across the motherboard, minimizing the risk of any damage or malfunction.

Included with the platform is a high-quality stencil that perfectly fits the motherboard of the mentioned iPhone models. This stencil simplifies the reballing process, allowing for precise placement of the tin balls. With the RELIFE 10 IN 1 BGA Reballing Platform and stencil, you can achieve professional-grade results without the need for extensive technical expertise.

Upgrade your iPhone repair toolkit with the RELIFE 10 IN 1 BGA Reballing Platform. Its middle-level tin planting process and compatible stencil make it the ideal choice for reballing the motherboards of iPhone X, XS, 11, 11 Pro, and 12 Pro Max.

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