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Amaoe U17 BGA Reballing Stencil Set for Snapdragon 8Gen1 SM8450 0.12mm CPU IC Chip Welding Template Tin Plant Net Steel Mesh

Home » Tools » Welding & Soldering Supplies » Amaoe U17 BGA Reballing Stencil Set for Snapdragon 8Gen1 SM8450 0.12mm CPU IC Chip Welding Template Tin Plant Net Steel Mesh
Enlarge Amaoe U17 BGA Reballing Stencil Set for Snapdragon 8Gen1 SM8450 0.12mm CPU IC Chip Welding Template Tin Plant Net Steel Mesh
Amaoe U17 BGA Reballing Stencil Set for Snapdragon 8Gen1 SM8450 0.12mm CPU IC Chip Welding Template Tin Plant Net Steel Mesh enlarge
Amaoe U17 BGA Reballing Stencil Set for Snapdragon 8Gen1 SM8450 0.12mm CPU IC Chip Welding Template Tin Plant Net Steel Mesh enlarge
Amaoe U17 BGA Reballing Stencil Set for Snapdragon 8Gen1 SM8450 0.12mm CPU IC Chip Welding Template Tin Plant Net Steel Mesh enlarge
Amaoe U17 BGA Reballing Stencil Set for Snapdragon 8Gen1 SM8450 0.12mm CPU IC Chip Welding Template Tin Plant Net Steel Mesh enlarge
Price from: 57.58 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe U17 BGA Reballing Stencil Set for Snapdragon 8Gen1 SM8450 0.12mm CPU IC Chip Welding Template Tin Plant Net Steel Mesh
Introducing the Amaoe U17 BGA Reballing Stencil Set, the perfect solution for reballing the Snapdragon 8Gen1 SM8450 0.12mm CPU IC Chip. This comprehensive set includes a high-quality welding template made of tin plant net steel mesh, ensuring durability and precision. Designed specifically for professionals and enthusiasts alike, this stencil set is a must-have tool for anyone involved in chip repair and reballing.

The Amaoe U17 BGA Reballing Stencil Set is engineered to meet the demands of modern chip reworking techniques. The 0.12mm thickness of the stencil ensures accurate alignment and allows for precise solder ball placement, resulting in reliable and efficient reballing. The tin plant net steel mesh used in the welding template guarantees excellent heat resistance and long-lasting performance, making it an ideal choice for repeated use.

With this stencil set, you can confidently tackle reballing tasks on the Snapdragon 8Gen1 SM8450 CPU IC Chip. Its user-friendly design and precise dimensions make it easy to handle and align, saving you time and effort during the reballing process. Whether you are a professional technician or a hobbyist, the Amaoe U17 BGA Reballing Stencil Set is the perfect companion for achieving flawless chip repairs and reballing, ensuring the optimal performance of your devices.

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