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Amaoe SF1 SSDPEBKF128G7 BGA Reballing Stencil Surface Tablet Notebook Tin Planting Net Steel Mesh 0.12MM

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Price from: 59.83 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe SF1 SSDPEBKF128G7 BGA Reballing Stencil Surface Tablet Notebook Tin Planting Net Steel Mesh 0.12MM
The Amaoe SF1 SSDPEBKF128G7 BGA Reballing Stencil is a high-quality tool designed to assist in the reballing process for BGA chips. Whether you are working with a surface tablet, notebook, or any other electronic device, this stencil is perfect for achieving precise and accurate results. Made with durable materials, including a tin planting net steel mesh with a thickness of 0.12MM, this stencil ensures longevity and reliability.

With the Amaoe SF1 SSDPEBKF128G7 BGA Reballing Stencil, you can confidently reball BGA chips without worrying about misalignment or poor solder connections. The stencil's fine steel mesh allows for the smooth application of solder balls, ensuring optimal conductivity and stability. Its 0.12MM thickness provides just the right amount of flexibility, allowing for easy handling and positioning during the reballing process.

Whether you are a professional technician or a DIY enthusiast, the Amaoe SF1 SSDPEBKF128G7 BGA Reballing Stencil is an essential tool for any electronic repair or modification project. Its compatibility with various devices, including surface tablets and notebooks, makes it a versatile choice. Invest in this high-quality stencil and experience the convenience and precision it brings to your reballing tasks.

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