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Amaoe BGA Reballing Stencil Template for Phone 6-12Mini without CPU IC Chip Solering Steel Mesh 0.12mm Thickness

Home » Tools » Welding & Soldering Supplies » Amaoe BGA Reballing Stencil Template for Phone 6-12Mini without CPU IC Chip Solering Steel Mesh 0.12mm Thickness
Enlarge Amaoe BGA Reballing Stencil Template for Phone 6-12Mini without CPU IC Chip Solering Steel Mesh 0.12mm Thickness
Amaoe BGA Reballing Stencil Template for Phone 6-12Mini without CPU IC Chip Solering Steel Mesh 0.12mm Thickness enlarge
Amaoe BGA Reballing Stencil Template for Phone 6-12Mini without CPU IC Chip Solering Steel Mesh 0.12mm Thickness enlarge
Amaoe BGA Reballing Stencil Template for Phone 6-12Mini without CPU IC Chip Solering Steel Mesh 0.12mm Thickness enlarge
Amaoe BGA Reballing Stencil Template for Phone 6-12Mini without CPU IC Chip Solering Steel Mesh 0.12mm Thickness enlarge
Amaoe BGA Reballing Stencil Template for Phone 6-12Mini without CPU IC Chip Solering Steel Mesh 0.12mm Thickness enlarge
Amaoe BGA Reballing Stencil Template for Phone 6-12Mini without CPU IC Chip Solering Steel Mesh 0.12mm Thickness enlarge
Price from: 50.48 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe BGA Reballing Stencil Template for Phone 6-12Mini without CPU IC Chip Solering Steel Mesh 0.12mm Thickness
Introducing the Amaoe BGA Reballing Stencil Template, the ultimate solution for repairing your Phone 6-12Mini without the hassle of dealing with a CPU IC chip soldering. This high-quality stencil template is designed to make the reballing process easier and more efficient, allowing you to quickly and effectively repair your phone's motherboard.

Made from durable and reliable steel mesh, this stencil template ensures long-lasting performance and accuracy. With a thickness of 0.12mm, it provides the perfect balance between flexibility and stability, making it easy to handle and position on the motherboard. The precise design of the stencil template guarantees a precise alignment with the BGA pads, ensuring a seamless reballing process without any damage to the delicate components.

Whether you are a professional technician or a DIY enthusiast, the Amaoe BGA Reballing Stencil Template is a must-have tool in your repair kit. It saves you time and effort by eliminating the need for soldering the CPU IC chip, allowing you to focus on the main task at hand. Don't let a faulty motherboard hold you back – with this stencil template, you can easily and effectively restore your Phone 6-12Mini to its full functionality in no time.

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