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AMAOE BGA Reballing Stencil For Xperia5II Motherboard Middle Layer IC Chip Solder Template Phone Repair Tools Tin Planting

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AMAOE BGA Reballing Stencil For Xperia5II Motherboard Middle Layer IC Chip Solder Template Phone Repair Tools Tin Planting enlarge
Price from: 55.50 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

AMAOE BGA Reballing Stencil For Xperia5II Motherboard Middle Layer IC Chip Solder Template Phone Repair Tools Tin Planting
The AMAOE BGA Reballing Stencil is a must-have tool for anyone involved in phone repair or electronics soldering. Specifically designed for the Xperia5II motherboard's middle layer IC chip, this stencil ensures precise and accurate soldering during the reballing process.

Crafted with high-quality materials, this solder template is built to last and withstand the demands of professional use. The stencil's tin planting feature allows for easy and efficient soldering, ensuring a strong and reliable connection between the IC chip and the motherboard.

Whether you are a professional technician or a DIY enthusiast, this BGA reballing stencil is a valuable addition to your repair tools collection. It simplifies the intricate process of reballing, making it easier to repair and replace IC chips on the Xperia5II motherboard. With the AMAOE BGA Reballing Stencil, you can confidently tackle phone repairs and achieve professional-grade results.

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