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AMAOE BGA Reballing Stencil for Phone 6-14 Series 0.12mm CPU Chip Tin Planting Steel Mesh Net Soldering Repair Template

Home » Tools » Welding & Soldering Supplies » AMAOE BGA Reballing Stencil for Phone 6-14 Series 0.12mm CPU Chip Tin Planting Steel Mesh Net Soldering Repair Template
Enlarge AMAOE BGA Reballing Stencil for Phone 6-14 Series 0.12mm CPU Chip Tin Planting Steel Mesh Net Soldering Repair Template
AMAOE BGA Reballing Stencil for Phone 6-14 Series 0.12mm CPU Chip Tin Planting Steel Mesh Net Soldering Repair Template enlarge
AMAOE BGA Reballing Stencil for Phone 6-14 Series 0.12mm CPU Chip Tin Planting Steel Mesh Net Soldering Repair Template enlarge
AMAOE BGA Reballing Stencil for Phone 6-14 Series 0.12mm CPU Chip Tin Planting Steel Mesh Net Soldering Repair Template enlarge
AMAOE BGA Reballing Stencil for Phone 6-14 Series 0.12mm CPU Chip Tin Planting Steel Mesh Net Soldering Repair Template enlarge
AMAOE BGA Reballing Stencil for Phone 6-14 Series 0.12mm CPU Chip Tin Planting Steel Mesh Net Soldering Repair Template enlarge
AMAOE BGA Reballing Stencil for Phone 6-14 Series 0.12mm CPU Chip Tin Planting Steel Mesh Net Soldering Repair Template enlarge
Price from: 50.55 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

AMAOE BGA Reballing Stencil for Phone 6-14 Series 0.12mm CPU Chip Tin Planting Steel Mesh Net Soldering Repair Template
The AMAOE BGA Reballing Stencil is a must-have tool for any phone repair professional working with the Phone 6-14 Series. This stencil is specifically designed to assist in the reballing process of the CPU chip, ensuring a precise and efficient repair. Crafted from high-quality 0.12mm CPU chip tin planting steel mesh net, this stencil guarantees durability and longevity.

With the AMAOE BGA Reballing Stencil, you can effortlessly restore the functionality of various phone models in the Phone 6-14 Series. The stencil's precise design and dimensions ensure a perfect fit for the CPU chip, allowing for accurate soldering and repair. Its steel mesh net construction enhances heat dissipation, preventing any damage to the chip during the reballing process.

This soldering repair template is a versatile tool that enables you to achieve professional-grade results. Whether you are a seasoned technician or a DIY enthusiast, the AMAOE BGA Reballing Stencil makes the reballing process efficient and hassle-free. Invest in this high-quality stencil to enhance your phone repair capabilities and deliver exceptional results to your customers.

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