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433 Pcs Universal Direct Heating BGA Reballing Stencils Kit For MTK Samsung HTC Xbox Huawei Android Ps3 Free Gift Direct Heat Ji

Home » Tools » Welding & Soldering Supplies » 433 Pcs Universal Direct Heating BGA Reballing Stencils Kit For MTK Samsung HTC Xbox Huawei Android Ps3 Free Gift Direct Heat Ji
Enlarge 433 Pcs Universal Direct Heating BGA Reballing Stencils Kit For MTK Samsung HTC Xbox Huawei Android Ps3 Free Gift Direct Heat Ji
433 Pcs Universal Direct Heating BGA Reballing Stencils Kit For MTK Samsung HTC Xbox Huawei Android Ps3 Free Gift Direct Heat Ji enlarge
433 Pcs Universal Direct Heating BGA Reballing Stencils Kit For MTK Samsung HTC Xbox Huawei Android Ps3 Free Gift Direct Heat Ji enlarge
433 Pcs Universal Direct Heating BGA Reballing Stencils Kit For MTK Samsung HTC Xbox Huawei Android Ps3 Free Gift Direct Heat Ji enlarge
433 Pcs Universal Direct Heating BGA Reballing Stencils Kit For MTK Samsung HTC Xbox Huawei Android Ps3 Free Gift Direct Heat Ji enlarge
433 Pcs Universal Direct Heating BGA Reballing Stencils Kit For MTK Samsung HTC Xbox Huawei Android Ps3 Free Gift Direct Heat Ji enlarge
433 Pcs Universal Direct Heating BGA Reballing Stencils Kit For MTK Samsung HTC Xbox Huawei Android Ps3 Free Gift Direct Heat Ji enlarge
Price from: 55.25 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

433 Pcs Universal Direct Heating BGA Reballing Stencils Kit For MTK Samsung HTC Xbox Huawei Android Ps3 Free Gift Direct Heat Ji
Introducing the 433 Pcs Universal Direct Heating BGA Reballing Stencils Kit, the ultimate solution for repairing and reballing BGA chips in a wide range of electronic devices. This comprehensive kit includes a variety of stencils specifically designed for MTK, Samsung, HTC, Xbox, Huawei, Android, and Ps3 devices, ensuring compatibility with a vast array of popular brands. Whether you are a professional technician or a DIY enthusiast, this kit provides all the necessary tools to successfully reball BGA chips with ease.

With 433 pieces in total, this kit offers an extensive selection of stencils to accommodate various chip sizes and layouts. The stencils are made from high-quality materials, ensuring durability and longevity. Each stencil is meticulously crafted to provide precise and accurate reballing, guaranteeing optimal performance and reliability of the repaired devices. Additionally, the stencils are designed for direct heating, which allows for efficient and effective reballing without the need for expensive reflow equipment.

As a bonus, this kit also includes a free gift - the Direct Heat Ji. This innovative tool enhances the reballing process by providing direct heat to the chip, facilitating the reflow of solder balls. The Direct Heat Ji is easy to use and ensures consistent and reliable heating, resulting in successful reballing and minimizing the risk of damage to the chip or surrounding components. With the 433 Pcs Universal Direct Heating BGA Reballing Stencils Kit and

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